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Dimensity 7000 chip specs revealed



Dimensity 7000 chip specs revealed


MediaTek hadn’t been heard of for a while, yet now the company is making a comeback with the announcement of a new super-performing chip, the Dimensity 9000. But beyond that, the company is poised to also release the new Dimensity 7000, which should outperform the Snapdragon 870 in terms of performance. For the moment, MediaTek has scheduled a press event in China for December 16th, and this could be the right occasion to learn more about the new chips. In the meantime, we were able to gather some preview information on the company’s new product.

Dimensity 7000: everything we know

Recently, the insider Digital Chat Station revealed MediaTek’s plans to release a competitor to the Snapdragon 870 chip, releasing some details on the processor’s characteristics. Apparently, the Dimensity 7000 will be produced using a TSMC’s 5-nanometer process. And it will receive two core clusters: four Cortex-A78 cores with a peak frequency of 2.75 GHz and a quartet of energy-efficient Cortex-A55 cores operating at a frequency of 2.0 GHz. The Mali-G510 MC6 graphics subsystem, on the other hand. , will be responsible for the graphic elaboration.

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In short, features worthy of note, as are those of the new Dimensity 9000. So far, in fact, MediaTek has always been second to Qualcomm, but with the latest proposals it seems ready to compete in all respects with Snapdragon chipsets. From what we know, in fact, the Dimensity 9000 is about the 35% more productive compared to Snapdragon 888. And it would be very similar, in terms of performance, to the A15 that Apple has mounted on the iPhone 13. In short, between Dimensity 7000 and 9000 MediaTek’s proposals seem really ready to conquer the market. We just have to wait for the event on December 16th and know which of the new chips will actually be released soon.